Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hideki Ueda
Date of Patent
September 12, 2023
Patent Application Number
16589336
Date Filed
October 1, 2019
Patent Citations
Patent Primary Examiner
A ground plane is disposed in a dielectric substrate or on the top surface of the dielectric substrate. A high-frequency semiconductor device is mounted on the bottom surface of the dielectric substrate. A shield structure that is provided in a space closer to the bottom surface than the ground plane is surrounds the high-frequency semiconductor device from below and sideways of the high-frequency semiconductor device and is connected to the ground plane. An opening is formed in the shield structure. A radiation-structure portion causes a high-frequency signal output by the high-frequency semiconductor device to be radiated through the opening.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
