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US Patent 11758687 Hot swap condenser for immersion cooling

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
September 22, 2021
Date of Patent
September 12, 2023
Patent Application Number
17481778
Patent Citations
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US Patent 10645841 Cooling device
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US Patent 10750637 Immersion cooling infrastructure module having compute device form factor
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US Patent 9516792 Ultrasound assisted immersion cooling
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US Patent 10401924 Liquid immersion cooling system
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US Patent 10477726 Liquid immersion cooling platform
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US Patent 10624242 System and method of packaging computing resources for space and fire-resistance
Patent Inventor Names
Kar-Wing Lau
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11758687
Patent Primary Examiner
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Courtney L Smith

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