Patent attributes
Provided is a power semiconductor cooling module for an electric vehicle. The power semiconductor cooling module for an electric vehicle, according to one exemplary embodiment of the present invention, is electrically connected to a motor and comprises: a box-shaped housing part having an inner space; a power element part disposed in the inner space and electrically connected to a motor via at least one busbar; a heat dissipation part disposed in the inner space so as to make contact with the power element part in order to cool heat generated from the power element part; and a heat backflow prevention member disposed so as to surround at least a portion of the total length of the busbar, and disposed so as to make contact with the heat dissipation part.
