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US Patent 11759910 Method of manufacturing wafer holder

Overview Structured Data Issues Contributors Activity

Is a

Date Filed

December 18, 2019

Date of Patent

September 19, 2023

Patent Application Number

16718800

Patent Citations

US Patent 7790503 Semiconductor device and method of forming integrated passive device module

US Patent 8795033 Lapping carrier and method

US Patent 9337086 Die up fully molded fan-out wafer level packaging

US Patent 9219004 Method of fabricating polymer film in the cavity of a wafer

US Patent 9539695 Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers

US Patent 7579259 Simplified method of producing an epitaxially grown structure

US Patent 7605009 Method of fabrication MEMS integrated circuits

Patent Inventor Names

Mara Lindsay Pagano

Gary William Wimmersberger

David Melville Hutton

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Primary Examiner

Matthew J Daniels

CPC Code

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