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US Patent 11764172 Integrated circuit, front-end module, and communication apparatus
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Date Filed
January 28, 2022
Date of Patent
September 19, 2023
Patent Application Number
17586940
Patent Citations
US Patent 9743519 High-frequency component and high-frequency module including the same
US Patent 9985586 Front end circuit
US Patent 7245884 RF module
US Patent 7569925 Module with built-in component
US Patent 7741710 Module with multiple power amplifiers and power sensors
US Patent 7804365 Multilayer amplifier module
US Patent 7885613 Multiband high-frequency circuit, multiband high-frequency circuit device and multiband communications apparatus comprising same
US Patent 8036148 High-frequency circuit, high-frequency device and communications apparatus
US Patent 8536957 High-frequency circuit module having a duplexer disposed between specified module integrated circuits
US Patent 8831535 High-frequency module
•••
Patent Inventor Names
Hiroshi Nishikawa
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11764172
Patent Primary Examiner
Tuan A. Tran
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