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US Patent 11768229 Packaged current sensor integrated circuit

Patent 11768229 was granted and assigned to Allegro Microsystems, Llc on September, 2023 by the United States Patent and Trademark Office.

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Is a
Patent
Patent

Patent attributes

Patent Applicant
Allegro Microsystems, Llc
Allegro Microsystems, Llc
Current Assignee
Allegro Microsystems, Llc
Allegro Microsystems, Llc
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11768229
Patent Inventor Names
Robert A. Briano
Rishikesh Nikam
Bradley Boden
Date of Patent
September 26, 2023
Patent Application Number
17654254
Date Filed
March 10, 2022
Patent Citations
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US Patent 7476816 Current sensor
‌
US Patent 7166807 Current sensor
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US Patent 7265531 Integrated current sensor
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US Patent 7372147 Supporting a circuit package including a substrate having a solder column array
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US Patent 10333055 Methods for magnetic sensor having non-conductive die paddle
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US Patent 10345343 Current sensor isolation
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US Patent 10509058 Current sensor using modulation of or change of sensitivity of magnetoresistance elements
‌
US Patent 10578684 Magnetic field sensor having magnetoresistance elements with opposite bias directions
...
Patent Primary Examiner
‌
Patrick Assouad
CPC Code
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G01R 15/202
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G01R 15/207
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G01R 19/252
Patent abstract

A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by a magnetic sensing element supported by a semiconductor die adjacent to the primary conductor. The primary current path contains a mechanical locking feature. The thickness of the molded body of the package is reduced to improve vibration immunity.

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