US Patent 11768235 Test circuit and method
Patent 11768235 was granted and assigned to Taiwan Semiconductor Manufacturing Company on September, 2023 by the United States Patent and Trademark Office.
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US Patent 11768235 Test circuit and method
Article
Patent abstract
An IC includes a plurality of pads at a top surface of a semiconductor wafer, an amplifier configured to receive a first AC signal at an input terminal, and output a second AC signal at an output terminal, a first detection circuit coupled to the input terminal and configured to output a first DC voltage to a first pad of the plurality of pads responsive to the first AC signal, and a second detection circuit coupled to the output terminal and configured to output a second DC voltage to a second pad of the plurality of pads responsive to the second AC signal.
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hsieh-Hung Hsieh
Tzu-Jin Yeh
Yen-Jen Chen
Date of Patent
September 26, 2023
Patent Application Number
18151959
Date Filed
January 9, 2023
Patent Citations
Patent Primary Examiner
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