Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Cheng-Chi Wang
Hung-Sheng Chou
Yeong-E Chen
Wen-Hsiang Liao
Cheng-En Cheng
Date of Patent
September 26, 2023
Patent Application Number
17520599
Date Filed
November 5, 2021
Patent Citations
Patent Primary Examiner
Patent abstract
A manufacturing method of a semiconductor package is provided. The manufacturing method includes the following. A plurality of semiconductor components are provided. Each semiconductor component has at least one conductive bump. A substrate is provided. The substrate has a plurality of conductive pads. A transfer device is provided. The transfer device transfers the semiconductor components onto the substrate. A heating device is provided. The heating device heats or pressurizes at least two semiconductor components. During transferring of the semiconductor components to the substrate, the at least one conductive bump of each semiconductor component is docked to a corresponding one of the conductive pads.
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