Patent 11774017 was granted and assigned to Tokyo Electron on October, 2023 by the United States Patent and Trademark Office.
A pipe connection structure provided in a processing apparatus, includes a first pipe having a first flange portion formed at one end thereof, a second pipe having a second flange portion formed at one end thereof and connected to the first flange portion, and a pipe clamp configured to connect and fasten the first flange portion and the second flange portion at a plurality of positions including a position where a pipe axis of the first pipe and a pipe axis of the second pipe do not coincide with each other.