Patent attributes
A loop heat pipe includes: an evaporator; a condenser; a liquid pipe that connects the evaporator and the condenser; a vapor pipe that connects the evaporator and the condenser to form a loop flow path; and a porous body provided inside of a part of the evaporator, the condenser, the liquid pipe, and the vapor pipe. The evaporator, the condenser, the liquid pipe, and the vapor pipe have a first main surface. At least one recessed portion is formed in at least part of a first area, located directly above or below the flow path, of the first main surface, and is not formed in a second area, located directly above or directly below a pipe wall of the flow path, of the first main surface and is not formed in a third area, located directly above or below the porous body, of the first main surface.
