US Patent 11774693 Optical transceiver modules and heat management techniques therefor

An I/O connector includes a body comprising a first surface, a second surface, side surfaces extending between the first surface and the second surface, and a cable entrance port at a rear end of the body extending toward a front end of the body. The I/O connector includes a printed circuit board (PCB) positioned between the first surface and the second surface of the body. The PCB includes a first set of one or more electrical components mounted on a first side of the PCB. A first heatsink is disposed on the first surface. The I/O connector includes first heatpipe thermally coupled with the first heatsink and the first set of one or more electrical components, positioned between the first surface and the first side of the PCB.