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US Patent 11776847 Contact structure for semiconductor device
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Patent
Date Filed
August 9, 2021
Date of Patent
October 3, 2023
Patent Application Number
17397621
Patent Citations
US Patent 10083863 Contact structure for semiconductor device
US Patent 10679896 Contact structure for semiconductor device
US Patent 9935051 Multi-level metallization interconnect structure
Patent Citations Received
US Patent 12107133 Semiconductor devices and methods of manufacture
0
Patent Inventor Names
Cha-Hsin Chao
Yi-Wei Chiu
Yun-Yu Hsieh
Ying Ting Hsia
Jeng Chang Her
Li-Te Hsu
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11776847
Patent Primary Examiner
Peniel M Gumedzoe
CPC Code
H01L 29/785
H01L 29/66795
H01L 29/41791
H01L 23/485
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