Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Son Thai Lu
Robert Edward Higashi
Elenita Malasmas Chanhvongsak
Date of Patent
October 3, 2023
Patent Application Number
17822596
Date Filed
August 26, 2022
Patent Citations
Patent Primary Examiner
Patent abstract
One or more embodiments are directed to establishing electrical connections through silicon wafers with low resistance and high density, while at the same time maintaining processability for further fabrication. Such connections through silicon wafers enable low resistance connections from the top side of a silicon wafer to the bottom side of the silicon wafer.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
