Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Dongho Kim
Hwanpil Park
Date of Patent
October 3, 2023
Patent Application Number
17360730
Date Filed
June 28, 2021
Patent Citations
Patent Primary Examiner
Patent abstract
A semiconductor package including: a first wiring structure; a semiconductor chip disposed on the first wiring structure; a second wiring structure disposed on the semiconductor chip and including a cavity; and a filling member between the first wiring structure and the second wiring structure and in the cavity, wherein an uppermost end of the filling member and an uppermost end of the second wiring structure are located at the same level.
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