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US Patent 11776982 Image sensor chip
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Patent
Date Filed
December 28, 2020
Date of Patent
October 3, 2023
Patent Application Number
17134699
Patent Citations
US Patent 9773831 Stacked type image sensors having a through silicon via structure
US Patent 9978791 Image sensor and method for manufacturing the same
US Patent 9935037 Multi-stacked device having TSV structure
US Patent 10236273 Packaging structure including interconnecs and packaging method thereof
US Patent 9536777 Interconnect apparatus and method
US Patent 9728572 Via structures including etch-delay structures and semiconductor devices having via plugs
Patent Inventor Names
Hyunyoung Yeo
Dongchan Kim
Kyungrae Byun
Bokwon Kim
Doowon Kwon
Jungchak Ahn
Minho Jang
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11776982
Patent Primary Examiner
Fernando L Toledo
CPC Code
H01L 27/1463
H01L 2225/06541
H01L 23/481
H01L 21/76898
H01L 25/0657
H01L 27/14634
H01L 27/14627
H01L 27/14623
H01L 27/14621
H01L 27/14636
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