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US Patent 11778790 Fluid cooling system

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
March 23, 2022
Date of Patent
October 3, 2023
Patent Application Number
17702306
Patent Citations
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US Patent 7911782 Liquid submersion cooling system
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US Patent 9451726 Method and apparatus to manage coolant pressure and flow for an array of liquid submerged electronic devices
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US Patent 9560789 System and method for fluid cooling of electronic devices installed in a sealed enclosure
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US Patent 9596787 Cooling electronic devices in a data center
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US Patent 10257963 Methods and system for oil immersion cooling
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US Patent 10271456 Enclosure for liquid submersion cooled electronics
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US Patent 10390458 Liquid submersion cooled electronic systems and devices
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US Patent 10609839 Liquid submersion cooled electronic systems and devices
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US Patent 10638641 Cooling rack
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US Patent 10667434 Liquid immersion cooling device
•••
Patent Citations Received
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US Patent 11963337 Contactless device and chip thermal management plate
0
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US Patent 12133361 Rack-based management of leaks in liquid cooled information handling systems
0
Patent Inventor Names
Andrew Young
Neil Edmunds
David Amos
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11778790
Patent Primary Examiner
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Robert J Hoffberg
CPC Code
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H05K 7/20809
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H05K 7/20772
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H05K 7/20672
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H05K 7/20636
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H05K 7/203
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H05K 7/20236

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