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US Patent 11778825 Method of fabricating a vertical semiconductor device
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Patent
Date Filed
March 24, 2022
Date of Patent
October 3, 2023
Patent Application Number
17702967
Patent Citations
US Patent 9997534 Vertical memory devices
US Patent 9985098 Bulb-shaped memory stack structures for direct source contact in three-dimensional memory device
US Patent 10062707 Semiconductor device and method of manufacturing the same
US Patent 9355727 Three-dimensional memory structure having a back gate electrode
US Patent 9978771 Manufacturing method of semiconductor device including multi-layered source layer and channel extending therethrough
Patent Inventor Names
Minkyung Bae
Taehun Kim
Myunghun Woo
Doohee Hwang
Bongyong Lee
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11778825
Patent Primary Examiner
Hsien-Ming Lee
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