US Patent 11779359 Systems and methods for Lapidus repair of bunions

Systems, devices, and methods for performing Lapidus bunionectomy procedures are disclosed. An example method includes inserting a plurality of metatarsal pins into the first metatarsal at a first predetermined spacing relative to the first tarsometatarsal (TMT) joint, excising the first TMT joint by cutting the bases of the first metatarsal and the first cuneiform proximate the first TMT joint, inserting a plurality of cuneiform pins into the first cuneiform at a second predetermined spacing relative to the first TMT joint, compressing the first TMT joint using a compressor block such that a cut face of the first metatarsal contacts a cut face of the first cuneiform, and fixing the first TMT joint using a bone plate and a plurality of bone screws. At least one of the plurality of bone screws may be a cross screw extending at an angle of less than 90 degrees relative to the bone plate and may anchor the resected first TMT joint to the second metatarsal or the second cuneiform to prevent recurrence of the bunion.