US Patent 11782225 Multi-fiber interface apparatus for photonic integrated circuit

Multi-fiber interface apparatuses providing a double reflection expanded beam arrangement include one or more substrates being configured to mountably receive a photonic integrated circuit (PIC), a fiber array coupling member mounted to a substrate, optical elements associated with the substrate and/or the fiber array coupling member, and one or more additional features. An additional feature according to certain implementations includes one or more passive substrate alignment features for aligning substrates to promote optical coupling between optical fibers and the PIC. In certain implementations configured for interfacing with printed circuit boards (PCBs), an additional feature includes a recess defined in an optically transmissive substrate in which a PIC is mounted, or includes a recess defined in a PCB into which the PIC is mounted. Various embodiments provide relaxed fiber alignment tolerances with simplified fabrication and system integration capabilities.