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US Patent 11782352 Lithography process monitoring method

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
July 26, 2022
Date of Patent
October 10, 2023
Patent Application Number
17815155
Patent Citations
‌
US Patent 8796666 MOS devices with strain buffer layer and methods of forming the same
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US Patent 8837810 System and method for alignment in semiconductor device fabrication
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US Patent 9093530 Fin structure of FinFET
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US Patent 9134633 System and method for dark field inspection
‌
US Patent 9230867 Structure and method for E-beam in-chip overlay mark
‌
US Patent 9404743 Method for validating measurement data
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US Patent 9304403 System and method for lithography alignment
‌
US Patent 9548303 FinFET devices with unique fin shape and the fabrication thereof
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US Patent 8716841 Photolithography mask and process
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US Patent 8736084 Structure and method for E-beam in-chip overlay mark
Patent Inventor Names
Ken-Hsien Hsieh
Shih-Chun Huang
Chih-Jie Lee
Ru-Gun Liu
Shih-Ming Chang
Yung-Sung Yen
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11782352
Patent Primary Examiner
‌
Christopher G Young
CPC Code
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G03F 9/7026

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