Patent attributes
According to one embodiment, a semiconductor storage device includes a board, a first electronic device mounted on the board, at least one second electronic device mounted on the board, and a heat dissipator. At least a portion of the second electronic device overlaps at least one of the board and the first electronic device in a first direction that is a thickness direction of the board. The heat dissipator includes a first member that includes a first portion located between the first electronic device and the second electronic device in the first direction, and a second member that includes a portion located between the first member and the second electronic device in the first direction. The second member is smaller in coefficient of thermal conductivity than the first member.
