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US Patent 11785768 Three-dimensional semiconductor memory devices
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Date Filed
June 28, 2021
Date of Patent
October 10, 2023
Patent Application Number
17360349
Patent Citations
US Patent 9530781 Three dimensional NAND memory having improved connection between source line and in-hole channel material as well as reduced damage to in-hole layers
US Patent 9583439 Memory device comprising memory strings penetrating through a stacking structure and electrically contacting with a metal layer and method for fabricating the same
US Patent 9627405 Semiconductor device and manufacturing method thereof
US Patent 9685452 Three-dimensional semiconductor device with vertical and horizontal channels in stack structure having electrodes vertically stacked on the substrate
US Patent 9711532 Three dimensional NAND memory having improved connection between source line and in-hole channel material as well as reduced damage to in-hole layers
US Patent 9799670 Three dimensional NAND device containing dielectric pillars for a buried source line and method of making thereof
US Patent 9716099 Semiconductor device and manufacturing method thereof
US Patent 9831266 Three-dimensional NAND device containing support pedestal structures for a buried source line and method of making the same
US Patent 9012974 Vertical memory devices and methods of manufacturing the same
US Patent 9508730 Semiconductor device and manufacturing method thereof
Patent Inventor Names
Joongshik Shin
Dongyoun Shin
Euntaek Jung
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11785768
Patent Primary Examiner
Joseph C. Nicely
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