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US Patent 11785861 Semiconductor structure and method of manufacturing the same

Patent 11785861 was granted and assigned to Taiwan Semiconductor Manufacturing Company on October, 2023 by the United States Patent and Trademark Office.

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Patent attributes

Patent Applicant

Taiwan Semiconductor Manufacturing Company

Current Assignee

Taiwan Semiconductor Manufacturing Company

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Inventor Names

Yuan-Tai Tseng

Fu-Ting Sung

Chung-Chiang Min

Shih-Chang Liu

Chern-Yow Hsu

Date of Patent

October 10, 2023

Patent Application Number

17305837

Date Filed

July 15, 2021

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Patent Primary Examiner

Julio J Maldonado

CPC Code

Patent abstract

The present disclosure provides a semiconductor structure, including an N

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