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US Patent 11786125 Implantable sensor electronics packaging

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
December 15, 2020
Date of Patent
October 17, 2023
Patent Application Number
17123101
Patent Citations
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US Patent 7812416 Methods and apparatus having an integrated circuit attached to fused silica
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US Patent 7854172 Hermetic chamber with electrical feedthroughs
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US Patent 7912525 Method and apparatus for enhancing the integrity of an implantable sensor device
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US Patent 8146422 High precision sensing for parameter measurement of the muscular-skeletal system
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US Patent 8278941 Strain monitoring system and apparatus
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US Patent 8439821 System and method for the central control of devices used during an operation
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US Patent 8486070 Telemetric orthopaedic implant
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US Patent 8661893 Prosthetic component having a compliant surface
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US Patent 8679186 Hermetically sealed prosthetic component and method therefor
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US Patent 8687865 Telemetric orthopaedic implant
•••
Patent Inventor Names
Mark Fichman
Jochen Walser
Maria Op de Beeck
Navid Shahriari
George Mikhail
Seulki Lee
Erfan Sheikhi
Dan Dlugos
Binh Vu
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11786125
Patent Primary Examiner
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Catherine B Kuhlman
CPC Code
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A61B 2562/02
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A61B 2562/04
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A61B 2562/043
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A61B 2562/0247
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A61B 2562/0252
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A61B 2562/0261
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A61B 2562/028
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A61B 2562/16
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A61B 2562/164
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A61B 2562/166
•••

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