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US Patent 11787111 Shaping material supply device and three-dimensional shaping apparatus
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Patent
Date Filed
March 22, 2021
Date of Patent
October 17, 2023
Patent Applicant
Seiko Epson
Patent Application Number
17207816
Patent Citations
US Patent 11446865 Print head for a 3D printer, with improved control
US Patent 11161297 Control methods for additive manufacturing system
US Patent 7874825 Nozzle for forming an extruded wall with rib-like interior
US Patent 10254499 Additive manufacturing of active devices using dielectric, conductive and magnetic materials
US Patent 10981332 Additive manufacturing material management station
US Patent 11034087 Shaping material supply device and three-dimensional shaping apparatus
Patent Inventor Names
Koichi Saito
Kohei Yuwaki
Kazuhide Nakamura
Shunsuke Mizukami
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11787111
Patent Primary Examiner
Nahida Sultana
CPC Code
B22F 10/10
B22F 10/18
B22F 12/53
B22F 12/57
B28B 1/001
B33Y 30/00
B33Y 40/00
B29B 7/401
B29B 7/402
B29B 7/407
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