US Patent 11789201 Package, optical device, and manufacturing method of package
Patent 11789201 was granted and assigned to Taiwan Semiconductor Manufacturing Company on October, 2023 by the United States Patent and Trademark Office.
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US Patent 11789201 Package, optical device, and manufacturing method of package
Article
Patent abstract
A package includes a photonic integrated circuit die, an electric integrated circuit die, and an encapsulant. The photonic integrated circuit die includes a semiconductor substrate and a waveguide. The semiconductor substrate has a notch. The waveguide is disposed over the semiconductor substrate. A portion of the waveguide is located within a span of the notch of the semiconductor substrate. The electric integrated circuit die is disposed over and electrically connected to the photonic integrated circuit die. The encapsulant laterally encapsulates the electric integrated circuit die.
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Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hsien-Wei Chen
Ming-Fa Chen
Date of Patent
October 17, 2023
Patent Application Number
17751666
Date Filed
May 24, 2022
Patent Citations
Patent Primary Examiner
CPC Code
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