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US Patent 11789610 3D-stacked memory with reconfigurable compute logic

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
Date Filed
June 21, 2021
Date of Patent
October 17, 2023
Patent Application Number
17353393
Patent Citations
‌
US Patent 8737108 3D memory configurable for performance and power
‌
US Patent 9286948 Query operations for stacked-die memory device
‌
US Patent 8922243 Die-stacked memory device with reconfigurable logic
‌
US Patent 9959929 Memory device and method having on-board processing logic for facilitating interface with multiple processors, and computer system using same
‌
US Patent 8064739 Three-dimensional die stacks with inter-device and intra-device optical interconnect
‌
US Patent 8369123 Stacked memory module and system
Patent Inventor Names
Hongzhong Zheng
Dimin Niu
Mu-Tien Chang
Prasun Gera
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11789610
Patent Primary Examiner
‌
David Yi
CPC Code
‌
G06F 3/0673
‌
G06F 9/30196
‌
G06F 15/785
‌
G06F 13/14
‌
G06F 13/40
‌
G11C 7/1006
‌
G11C 5/04
‌
Y02D 10/00
‌
G06F 3/0659
‌
G06F 3/0635
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