US Patent 11791268 Tungsten structures and methods of forming the structures
Patent 11791268 was granted and assigned to Micron Technology on October, 2023 by the United States Patent and Trademark Office.
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US Patent 11791268 Tungsten structures and methods of forming the structures
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Patent abstract
Described are methods for forming a tungsten conductive structure over a substrate, such as a semiconductor substrate. Described examples include forming a silicon-containing material, such as a doped silicon-containing material, over a supporting structure. The silicon-containing material is then subsequently converted to a tungsten seed material containing the dopant material. A tungsten fill material of lower resistance will then be formed over the tungsten seed material.
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Patent Number
Patent Inventor Names
Christian George Emor
Everett Allen McTeer
Jordan D. Greenlee
Rita J. Klein
Travis Rampton
Date of Patent
October 17, 2023
Patent Application Number
17666093
Date Filed
February 7, 2022
Patent Citations
Patent Primary Examiner
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