US Patent 11791296 Dielectric and metallic nanowire bond layers
Patent 11791296 was granted and assigned to Texas Instruments on October, 2023 by the United States Patent and Trademark Office.
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US Patent 11791296 Dielectric and metallic nanowire bond layers
Article
Patent abstract
In some examples, an electronic device comprises a first component having a surface, a second component having a surface, and a bond layer positioned between the surfaces of the first and second components to couple the first and second components to each other. The bond layer includes a set of metallic nanowires and a dielectric portion. The dielectric portion comprises a polymer matrix and dielectric nanoparticles.
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Benjamin Stassen Cook
Ralf Jakobskrueger Muenster
Scott Robert Summerfelt
Sreenivasan Kalyani Koduri
Date of Patent
October 17, 2023
Patent Application Number
17544888
Date Filed
December 7, 2021
Patent Citations
Patent Primary Examiner
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