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US Patent 11792918 Co-axial via structure
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Patent
Date Filed
November 21, 2021
Date of Patent
October 17, 2023
Patent Application Number
17455918
Patent Citations
US Patent 10249943 Printed circuit board assembly with foam dielectric material
US Patent 9706656 Signal transmission board and method for manufacturing the same
US Patent 10448501 Circuit structure
US Patent 7767913 Electronic devices including conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, and accompanying methods
US Patent 8273995 Concentric vias in electronic substrate
Patent Inventor Names
Shih-Liang Cheng
Yi-Pin Lin
Ching-Sheng Chen
Heng-Ming Nien
Pei-Wei Wang
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11792918
Patent Primary Examiner
Jeremy C Norris
CPC Code
H05K 1/024
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