US Patent 11793091 Semiconductor structure and manufacturing method thereof
Patent 11793091 was granted and assigned to United Microelectronics Corporation on October, 2023 by the United States Patent and Trademark Office.
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US Patent 11793091 Semiconductor structure and manufacturing method thereof
Article
Patent abstract
The invention provides a semiconductor structure, the semiconductor structure includes a substrate, a resistance random access memory on the substrate, an upper electrode, a lower electrode and a resistance conversion layer between the upper electrode and the lower electrode, and a cap layer covering the outer side of the resistance random access memory, the cap layer has an upper half and a lower half, and the upper half and the lower half contain different stresses.
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Bin-Siang Tsai
Chih-Wei Chang
Da-Jun Lin
Shih-Wei Su
Ting-An Chien
Date of Patent
October 17, 2023
Patent Application Number
17114438
Date Filed
December 7, 2020
Patent Citations
Patent Primary Examiner
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