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US Patent 11801371 Microneedle device

Patent 11801371 was granted and assigned to National University of Singapore on October, 2023 by the United States Patent and Trademark Office.

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Patent attributes

Patent Applicant

National University of Singapore

Current Assignee

National University of Singapore

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Inventor Names

Lifeng Kang

Yuanyuan Sun

Duc-Viet Nguyen

Date of Patent

October 31, 2023

Patent Application Number

16490854

Date Filed

March 1, 2018

Patent Citations

US Patent 10828478 Microneedles and methods of manufacture thereof

US Patent 7588825 Embolic compositions

US Patent 11291816 Microneedle particles, compositions, and methods of treatment and delivering a substance of interest

Patent Primary Examiner

CPC Code

Patent abstract

There is provided a microneedle device comprising a substrate and a plurality of microneedles projecting from the substrate, the substrate being substantially spherical and wherein in use, the microneedle device has three-dimensional movement. There is also provided a method of forming the microneedle device of the present invention.

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