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US Patent 11804397 Parallel assembly of discrete components onto a substrate

Overview Structured Data Issues Contributors Activity

Is a

Date Filed

November 15, 2021

Date of Patent

October 31, 2023

Patent Application Number

17526534

Patent Citations

US Patent 10790173 Printed components on substrate posts

US Patent 10923641 Light-emitting device and manufacturing method thereof

US Patent 11201077 Parallel assembly of discrete components onto a substrate

US Patent 9496155 Methods of selectively transferring active components

US Patent 10032827 Systems and methods for transfer of micro-devices

US Patent 10070568 Method and apparatus for use in the manufacture of a display element

US Patent 10096740 Method for manufacturing color micro light-emitting diode array substrate

US Patent 10460971 Multi-chip package assembly

US Patent 10770620 Epitaxial gallium nitride based light emitting diode and method of making thereof

US Patent 6872635 Device transferring method, and device arraying method and image display unit fabricating method using the same

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Patent Inventor Names

Val Marinov

Ronn Kliger

Matthew R. Semler

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Primary Examiner

CPC Code

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