Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Brandon Marin
Whitney Bryks
Date of Patent
October 31, 2023
Patent Application Number
16020122
Date Filed
June 27, 2018
Patent Citations
Patent Primary Examiner
Patent abstract
A package substrate may include a build-up layer. The build-up layer may include a dielectric material and one or more microspheres. The one or more microspheres may include a magnetic core that includes a first material that is a first oxidation-resistant material. Further, the one or more microspheres may include a shell to encapsulate the core, and the shell may include a second material that is a second oxidation-resistant material. The package substrate may further include a metal layer coupled with the build-up layer.
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