US Patent 11805600 Dielectric substrate and method of forming the same
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US Patent 11805600 Dielectric substrate and method of forming the same
Article
Patent abstract
The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.
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Patent Jurisdiction
Patent Number
Patent Inventor Names
Gerard T. Buss
Jennifer Adamchuk
Theresa M. Besozzi
Date of Patent
October 31, 2023
Patent Application Number
18157918
Date Filed
January 23, 2023
Patent Citations
Patent Primary Examiner
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