US Patent 11805667 Encapsulation structure, electronic apparatus and encapsulation method

An encapsulation structure, an electronic apparatus, and an encapsulation method are provided. The encapsulation structure includes: a base substrate, an organic encapsulation layer and a barrier dam that are on the base substrate. The barrier dam is disposed outside the organic encapsulation layer; and the barrier dam includes an upper surface away from the base substrate and a side surface facing the organic encapsulation layer, and at least one of the upper surface and the side surface includes a groove and a protrusion.