Patent 11824299 was granted and assigned to Sony Semiconductor Solutions Corporation on November, 2023 by the United States Patent and Trademark Office.
A connector includes a cable including at least one core wire and a shielding wire arranged around the core wire with an insulating member interposed therebetween, a plug part connected to the cable and capable of fitting with a receptacle, a primary molded part including a connection portion between the core wire and a conductive member of the plug part, and a secondary molded part arranged at a lead-out portion of the cable. The dimension of the primary molded part is an outer diameter or a thickness of the plug part.