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US Patent 11833788 Method for producing a multi-layer substrate

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Mario Eckers0

Roland Bochnia0

Rainer Bongers0

Stefan Strenger0

Date of Patent

December 5, 2023

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Patent Application Number

169888120

Date Filed

August 10, 2020

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Patent Citations

US Patent 8568283 Method for inserting a first folded film within a second folded film

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US Patent 8747603 Adhesive having insulative properties

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US Patent 9056712 Thermally activatable insulating packaging

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US Patent 9260633 Electrically conductive adhesives comprising bucky paper and an adhesive resin

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US Patent 9273230 Hot melt assist waterborne adhesives and use thereof

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US Patent 9522772 Insulating packaging

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US Patent 9580228 Thermally activatable insulating packaging

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Patent Primary Examiner

Francisco W Tschen

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CPC Code

0

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Patent abstract

The present invention relates to a method for producing a multi-layer substrate, said substrate comprising a multifunctional coating, and to the use of the substrate produced by this method.

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