Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jill Marlene Orr0
Eric Bryan Bond0
John Brian Strube0
Matthew William Waldron0
Daniel Charles Peck0
Date of Patent
December 5, 2023
0Patent Application Number
172411070
Date Filed
April 27, 2021
0Patent Citations
...
Patent Primary Examiner
CPC Code
Patent abstract
Bonded formed laminates, and methods for making bonded formed laminates, are made from multiple layers of formed substrates comprising at least one nonwoven formed substrate which are bonded together at the distal ends or bases of protrusions formed in the substrates. The bonded formed laminate provides a very soft and lofty structure that is sustainable under compression.
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