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US Patent 11837445 Substrate processing device and substrate processing method
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Patent
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Date Filed
November 14, 2019
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Date of Patent
December 5, 2023
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Patent Application Number
17284438
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Patent Citations
US Patent 8043432 Atomic layer deposition systems and methods
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US Patent 8187679 Radical-enhanced atomic layer deposition system and method
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US Patent 8470718 Vapor deposition reactor for forming thin film
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US Patent 8691669 Vapor deposition reactor for forming thin film
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US Patent 8845857 Substrate processing apparatus
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US Patent 10246775 Film forming apparatus, method of forming film, and storage medium
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US Patent 11174553 Gas distribution assembly for improved pump-purge and precursor delivery
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US Patent 10480073 Rotating semi-batch ALD device
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US Patent 11189502 Showerhead with interlaced gas feed and removal and methods of use
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US Patent 6869641 Method and apparatus for ALD on a rotary susceptor
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•••
Patent Inventor Names
Chul-Joo Hwang
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11837445
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Patent Primary Examiner
Rudy Zervigon
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CPC Code
H01J 2237/332
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H01J 2237/3321
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H01J 37/32174
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C23C 16/45536
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C23C 16/45551
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C23C 16/45574
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C23C 16/52
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C23C 16/45538
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C23C 16/45525
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H01L 21/02274
0
•••
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