Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Michael John Bergmann0
David Todd Emerson0
Joseph G. Clark0
Christopher P. Hussell0
Date of Patent
December 5, 2023
0Patent Application Number
171035090
Date Filed
November 24, 2020
0Patent Citations
...
Patent Primary Examiner
CPC Code
Patent abstract
An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide LED dies that are joined to a carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
