US Patent 11837645 Method of manufacturing a semiconductor device

Patent

US Patent 7696092 Method of using ternary copper alloy to obtain a low resistance and large grain size interconnect

US Patent 7868456 Semiconductor device and method for fabricating the same

US Patent 8211797 Metal wiring layer and method of fabricating the same

US Patent 8778797 Systems and methods for selective tungsten deposition in vias

US Patent 9082791 Method of forming low-resistance wire and method of manufacturing thin film transistor using the same

US Patent 9082824 Method for forming an electrical connection between metal layers

US Patent 10256342 Methods of manufacturing fin field effect transistors (FinFETs) comprising reduced gate thicknesses overlying deep trenches

US Patent 10340219 Semiconductor device having a metal via

US Patent 11393756 Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems

US Patent 10734280 Integrated circuit devices and method of manufacturing the same

United States Patent and Trademark Office

Earl N Taylor

H01L 23/485

H01L 23/5226

H01L 23/53266

H01L 29/0673

H01L 29/0847

H01L 29/41766

H01L 29/41791

H01L 29/42392

H01L 29/456

H01L 29/66795