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US Patent 11842885 Plasma processing apparatus and plasma processing method
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Patent
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Date Filed
September 15, 2020
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Date of Patent
December 12, 2023
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Patent Application Number
17021149
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Patent Citations
US Patent 9960014 Plasma etching method
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US Patent 10217613 Plasma processing apparatus
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US Patent 10217610 Arrangements for manipulating plasma confinement within a plasma processing system and methods thereof
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US Patent 10418224 Plasma etching method
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US Patent 7771562 Etch system with integrated inductive coupling
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US Patent 8894806 Plasma processing apparatus and plasma processing method
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Patent Inventor Names
Masaru Izawa
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Tooru Aramaki
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Kenetsu Yokogawa
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11842885
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Patent Primary Examiner
Yuechuan Yu
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CPC Code
H01J 37/32045
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H01J 37/32577
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H01J 37/32183
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H01J 37/32192
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H01J 37/32174
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H01L 21/31116
0
H01J 37/32715
0
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