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US Patent 11844220 Integrated assemblies and methods of forming integrated assemblies

Patent 11844220 was granted and assigned to Micron Technology on December, 2023 by the United States Patent and Trademark Office.

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Patent abstract

Some embodiments include an integrated assembly having a first structure containing semiconductor material, and having a second structure contacting the first structure. The first structure has a composition along an interface with the second structure. The composition includes additive to a concentration within a range of from about 10

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