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US Patent 11850292 Bondable microcapsules and surface functionalized fillers

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
July 29, 2022
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Date of Patent
December 26, 2023
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Patent Application Number
17816220
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Patent Citations
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US Patent 10434046 Buffered microencapsulated compositions and methods
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US Patent 10434047 Buffered microencapsulated compositions and methods
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US Patent 10675227 Buffered microencapsulated compositions and methods
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US Patent 10688026 Buffered microencapsulated compositions and methods
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US Patent 11185479 Buffered microencapsulated compositions and methods
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US Patent 10758458 Bondable microcapsules and surface functionalized fillers
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US Patent 11406570 Bondable microcapsules and surface functionalized fillers
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US Patent 8889161 Microencapsulated compositions and methods for tissue mineralization
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US Patent 10434044 Buffered microencapsulated compositions and methods
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Patent Inventor Names
William A. McHale
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Mark A. Latta
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Stephen M. Gross
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11850292
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Patent Primary Examiner
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Mina Haghighatian
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CPC Code
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A61K 6/893
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A61K 6/62
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A61K 6/887
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A61K 6/69
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A61K 6/74
0

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