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US Patent 11850294 Buffered microencapsulated compositions and methods

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
November 23, 2021
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Date of Patent
December 26, 2023
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Patent Application Number
17456271
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Patent Citations
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US Patent 9498411 Microcapsules and uses thereof
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US Patent 9689024 Methods for droplet-based sample preparation
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US Patent 9814657 Buffered microencapsulated compositions and methods
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US Patent 10434044 Buffered microencapsulated compositions and methods
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US Patent 10434046 Buffered microencapsulated compositions and methods
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US Patent 10434047 Buffered microencapsulated compositions and methods
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US Patent 10675227 Buffered microencapsulated compositions and methods
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US Patent 10688026 Buffered microencapsulated compositions and methods
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US Patent 10758458 Bondable microcapsules and surface functionalized fillers
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US Patent 11185479 Buffered microencapsulated compositions and methods
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•••
Patent Inventor Names
Mark A. Latta
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William A McHale
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Stephen M. Gross
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11850294
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Patent Primary Examiner
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Mina Haghighatian
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CPC Code
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A61K 8/21
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A61K 8/24
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A61K 8/64
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A61K 6/69
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A61K 6/20
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A61K 8/11
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A61K 47/02
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A61K 8/19
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