US Patent 11850831 Component with bonded thermoplastic and thermoset layers
Patent 11850831 was granted and assigned to Rohr, Inc. on December, 2023 by the United States Patent and Trademark Office.
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US Patent 11850831 Component with bonded thermoplastic and thermoset layers
Article
Patent abstract
A component is provided that includes a multi-layer body configured with a thermoplastic layer, a thermoset layer and a scrim at an interface between the thermoplastic layer and the thermoset layer. The thermoplastic layer includes a plurality of reinforcement particles within a thermoplastic matrix. The thermoset layer is configured from or otherwise includes a thermoset matrix.
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Teresa Kruckenberg0
Date of Patent
December 26, 2023
0Patent Application Number
177165100
Date Filed
April 8, 2022
0Patent Citations
Patent Primary Examiner
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