US Patent 11852620 System and method for evaluating a bond
Patent 11852620 was granted and assigned to The Boeing Company on December, 2023 by the United States Patent and Trademark Office.
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US Patent 11852620 System and method for evaluating a bond
Article
Patent abstract
A system for evaluating a bond includes a first electrode and a second electrode that are spaced apart from one another. The system also includes a sacrificial material layer positioned proximate to a surface of a bonded structure that includes the bond. The system also includes a power source configured to cause the first and second electrodes to generate an electrical arc that at least partially ablates the sacrificial material layer as part of a non-destructive inspection of the bond.
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Morteza Safai0
Date of Patent
December 26, 2023
0Patent Application Number
174512900
Date Filed
October 18, 2021
0Patent Citations
Patent Primary Examiner
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