US Patent 11854635 Reclaimable semiconductor device package and associated systems and methods

Is a

Patent

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Patent Applicant

Micron Technology

Current Assignee

Micron Technology

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

118546350

Patent Inventor Names

Yueping Li0

Date of Patent

December 26, 2023

Patent Application Number

166539940

Date Filed

October 15, 2019

Patent Citations

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US Patent 7965575 Semiconductor memory device and method of providing product families of the same

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US Patent 7636274 Memory module with a circuit providing load isolation and memory domain translation

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US Patent 7715255 Programmable chip enable and chip address in semiconductor memory

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US Patent 7757037 Configurable flash memory controller and method of use

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US Patent 7779311 Testing and recovery in a multilayer device

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US Patent 7796461 Semiconductor device having a plurality of memory chips

Patent Primary Examiner

CPC Code

Patent abstract

Several embodiments of reclaimable semiconductor device packages and assemblies are disclosed herein. A semiconductor device assembly (

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US Patent 11854635 Reclaimable semiconductor device package and associated systems and methods

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