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US Patent 11854842 Substrate heat treatment apparatus
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Patent
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Date Filed
March 18, 2016
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Date of Patent
December 26, 2023
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Patent Application Number
16086227
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Patent Citations
US Patent 7467901 Substrate heat treatment apparatus
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US Patent 8519309 Wafer heating apparatus and semiconductor manufacturing apparatus
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US Patent 7927096 Substrate support structure, heat treatment apparatus using same, first sheet-like object for use in the substrate support structure, method of manufacturing the substrate support structure, heat treatment apparatus, and substrate sucking method
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US Patent 8608885 Substrate heat treatment apparatus
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US Patent 7417206 Heater, wafer heating apparatus and method for manufacturing heater
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US Patent 7432476 Substrate heat treatment apparatus
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Patent Inventor Names
Wenjun Wang
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Zhiyou Fang
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Hui Wang
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Hongchao Yang
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Fuping Chen
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Jun Wu
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11854842
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Patent Primary Examiner
Michael G Hoang
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CPC Code
F27D 5/0037
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F27B 17/0025
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H01L 21/68742
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H01L 21/67248
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H01L 21/67109
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